Technology of III-V, II-VI, and Non-Tetrahedrally Bonded Compounds / Technologie der III-VI, II-VI und nicht-tetraedrisch gebundenen Verbindungen (Landolt-Boernstein: Numerical Data and Functional Relationships in Science and Technology - New, 17d)

by J. Baars, P. Glasgow, R. Helbig, H Jacob, K. Kassel, H. Maier, G. Muller, and H. Runge

M Schulz (Editor) and H. Weiss (Editor)

0 ratings • 0 reviews • 0 shelved
Book cover for Technology of III-V, II-VI, and Non-Tetrahedrally Bonded Compounds / Technologie der III-VI, II-VI und nicht-tetraedrisch gebundenen Verbindungen
Shelve It

Bookhype may earn a small commission from qualifying purchases. Full disclosure.

  • ISBN13 9783540117797
  • Publish Date 1 November 1984
  • Publish Status Active
  • Publish Country DE
  • Publisher Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
  • Imprint Springer-Verlag Berlin and Heidelberg GmbH & Co. K
  • Edition 1984 ed.
  • Format Hardcover
  • Pages 429
  • Language English