Print proceedings of the ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2015): Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing, Interconnect and Reliability, Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales
Printed collection on 83 full-length, peer-reviewed technical papers. Topics include:
- Advanced Electronics and Photonics, Packaging Materials and Processing
- Advanced Electronics and Photonics: Packaging, Interconnect and Reliability
- Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales
- ISBN13 9780791856895
- Publish Date 30 July 2015
- Publish Status Active
- Publish Country US
- Imprint American Society of Mechanical Engineers,U.S.
- Format Paperback
- Pages 698
- Language English