Multichip Module Design, Fabrication and Testing (McGraw-Hill's Electronic Packaging & Interconnection S.)

by James J. Licari

0 ratings • 0 reviews • 0 shelved
Book cover for Multichip Module Design, Fabrication and Testing

Bookhype may earn a small commission from qualifying purchases. Full disclosure.

The advent of multichip modules (MCMs) is revolutionizing the ways in which electronic systems and equipment are designed, tested and manufactured. This evolving technology for packaging printed circuit boards (PCBs) is commanding both interest and excitement. This work describes MCM technology, as well as showing designers how to use it in practice. The guide covers practical issues such as electrical testing, rework procedures and failure modes and mechanisms.
  • ISBN10 0070377154
  • ISBN13 9780070377158
  • Publish Date 1 January 1994
  • Publish Status Out of Print
  • Out of Print 9 January 2001
  • Publish Country US
  • Publisher McGraw-Hill Education - Europe
  • Imprint McGraw-Hill Inc.,US
  • Format Hardcover
  • Pages 381
  • Language English