Prepared by the Highway Innovative Technology Evaluation Center (HITEC), a CERF Service Center.
The report describes a HITEC evaluation of Bondade CU-31 Bonding Solution, manufactured by Transpo Industries. The report describes a three-year program of field testing and evaluation designed to determine the effectiveness of Bondade CU-31 in extending the service life of pothole repairs.
- ISBN13 9780784403488
- Publish Date 1 January 1998
- Publish Status Active
- Publish Country US
- Imprint American Society of Civil Engineers
- Format Hardcover
- Pages 47
- Language English