Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
Proven 2D and 3D IC lead-free interconnect reliability techniquesReliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.
Covers reliability of:
- 2D and 3D IC lead-free interconnects
- CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints
- Lead-free (SACX) solder joints
- Low-temperature lead-free (SnBiAg) solder joints
- Solder joints with voids, high strain rate, and high ramp rate
- VCSEL and LED lead-free interconnects
- 3D LED and 3D MEMS with TSVs
- Chip-to-wafer (C2W) bonding and lead-free interconnects
- Wafer-to-wafer (W2W) bonding and lead-free interconnects
- 3D IC chip stacking with low-temperature bonding
- TSV interposers and lead-free interconnects
- Electromigration of lead-free microbumps for 3D IC integration
- ISBN13 9780071753791
- Publish Date 16 December 2010 (first published 1 December 2010)
- Publish Status Active
- Publish Country US
- Publisher McGraw-Hill Education - Europe
- Imprint McGraw-Hill Professional
- Format Hardcover
- Pages 640
- Language English