This is an introductory level book on the fundamentals of microelectronics packaging geared toward students, technicians, and electrical and electronic engineers who need a solid reference on the basics of microelectronics packaging and design. Culled from 12 chapters in the 3-volume Microelectronics Packaging Handbook, Third Edition, it is appropriate both as a reference for those already engaged in packaging design, first and second level packages and their interconnections, test, assembly, thermal management, optoelectronics, reliability, and manufacturing.
- ISBN10 041214901X
- ISBN13 9780412149016
- Publish Date March 1998
- Publish Status Active
- Out of Print 20 March 2008
- Publish Country GB
- Publisher Taylor & Francis Ltd
- Imprint Chapman and Hall
- Format Hardcover
- Pages 864
- Language English