Very Large Scale Integration (VLSI) technology has raised significant considerations of thermal control. This practical reference for thermal and design engineers addresses topics related to thermal cooling of electronic equipment. The text includes numerous examples and calculations from engineering applications and provides design guides for packaging and thermal engineers. It also examines the advancement of technologies in the electronic industry and addresses such questions as: what is the life expectancy of an air moving device?; how does one thermally characterize an electronic component?; how does one choose and optimize heat sink?; and what are the limitations of numerical simulation tools?
- ISBN10 0849316898
- ISBN13 9780849316890
- Publish Date 1 January 1998
- Publish Status Active
- Out of Print 10 September 2004
- Publish Country US
- Publisher Taylor & Francis Inc
- Imprint CRC Press Inc
- Format Hardcover
- Pages 300
- Language English