Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies

by Dr John H Lau

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  • ISBN10 0071704809
  • ISBN13 9780071704809
  • Publish Date 29 February 2000
  • Publish Status Temporarily Withdrawn
  • Publish Country US
  • Imprint McGraw-Hill Education
  • Format eBook
  • Pages 585
  • Language English