Reflow Soldering Processes and Troubleshooting Smt, BGA, CSP and Flip Chip Technologies

by Ning-Cheng Lee

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  • ISBN10 6611006672
  • ISBN13 9786611006679
  • Publish Date 1 January 2002
  • Publish Status Active
  • Out of Print 18 May 2011
  • Publish Country US
  • Imprint Elsevier Science & Technology
  • Format eBook
  • Pages 288
  • Language English