Advanced Electronic Packaging: With Emphasis on Multi-chip Modules (Microelectronics Systems S.) (IEEE Press Series on Microelectronic Systems)

by William Donald Brown

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"Packaging is rapidly becoming an area of microeclectronics technology which can limit the operating speed on an integrated circuit. To address this concern, much research and development attention now focuses on packaging in an effort to prevent it from impeding the speed of electronic systems. With ADVANCED ELECTRONIC PACKAGING, readers can learn about the full range of packaging concepts, from the introductory to the advanced level, and gain a deeper understanding of this rapidly growing area of microelectronics. As an excellent desk reference for practicing engineers or as an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the fabrication, testing, reliability, and packaging of integrated circuits, specifically, multichip modules (MCM). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design tradeoffs. Also addressed are the critical role of economics and future trends in electronic packaging." Sponsored by: IEEE Components, Packaging, and Manufacturing Technology Society.
  • ISBN10 0780347005
  • ISBN13 9780780347007
  • Publish Date 27 October 1998
  • Publish Status Out of Stock
  • Out of Print 7 April 2009
  • Publish Country US
  • Imprint John Wiley & Sons Inc
  • Format Hardcover
  • Pages 824
  • Language English