The 5th International Symposium on Advanced Packaging Materials was devoted to the advances made in electronic packaging materials. Topics covered in these proceedings include adhesives, integral passive materials, on-chip interconnect materials, underfills and encapsulent materials.
- ISBN10 0930815564
- ISBN13 9780930815561
- Publish Date 1 June 1999
- Publish Status Unknown
- Out of Print 23 December 2011
- Publish Country US
- Imprint I.E.E.E.Press
- Edition 1999, 5th International ed.
- Format Paperback
- Pages 372
- Language English