NEW! A comprehensive and up-to-date source of evaluated properties for a wide variety of materials used for semiconductor device packaging. The "Microelectronics Packaging Materials Database" provides the semiconductor packaging engineer with a comprehensive and up-to-date source of evaluated properties for a wide variety of materials used for semiconductor device packaging. Since materials play a strong role in packaging design, manufacturability, performance, reliability and cost, this database has a major impact on cost-effective packaging technologies. Key Features: Evaluated material property values based on worldwide open literature; Sponsored by the Semiconductor Research Corporation (SRC); Proprietary experimental data obtained from analysis and evaluation performed by experts; Easy to use graphical user interface (GUI); Data provided in tabular and graphic formats; Detailed material pedigree and metadata information; Meticulously referenced data; Thousands of multipoint curves and tables providing property information for hundreds of important packaging materials; Updated annually.
- ISBN10 0815514662
- ISBN13 9780815514664
- Publish Date December 2001
- Publish Status Out of Print
- Out of Print 8 January 2008
- Publish Country US
- Publisher William Andrew Publishing
- Imprint Plastics Design Library
- Format Hardcover
- Language English