Thermal Management on LED Packages and Applications

by Xiaobing Luo

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Written by a leading expert in LED packaging technologies, this book systematically introduces fundamental theory and practical design approaches to IC/LED product design. Readers get a good grounding in thermal management strategies with topics such as heat transfer fundamentals, thermal modeling, and thermal simulation and design. Additionally, cooling technologies and testing techniques are provided to help readers evaluate device performance and to shorten the design and manufacturing cycle.
  • ISBN10 1119179270
  • ISBN13 9781119179276
  • Publish Date 3 July 2015
  • Publish Status Cancelled
  • Publish Country SG
  • Imprint John Wiley & Sons (Asia) Pte Ltd
  • Format Hardcover
  • Pages 300
  • Language English