Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

by Sheng Liu and Yong Liu

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  • ISBN10 1299314422
  • ISBN13 9781299314429
  • Publish Date 10 May 2014
  • Publish Status Active
  • Out of Print 17 February 2015
  • Publish Country US
  • Imprint Wiley
  • Format eBook
  • Pages 588
  • Language English