Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.
- ISBN13 9781498745536
- Publish Date 30 November 2016 (first published 26 August 2016)
- Publish Status Active
- Publish Country GB
- Publisher Taylor & Francis Ltd
- Imprint CRC Press
- Format eBook
- Pages 216
- Language English