Thermal Stress and Strain in Microelectronics Packaging

by John Lau

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  • ISBN10 1468477684
  • ISBN13 9781468477689
  • Publish Date 5 August 1993
  • Publish Status Withdrawn
  • Out of Print 18 October 2014
  • Publish Country US
  • Imprint Springer My Copy UK
  • Format Paperback (US Trade)
  • Pages 908
  • Language English