BALL GRID ARRAY TECHNOLOGY

by John Lau

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This text covers ball grid array (BGA) design and manufacturing. BGA is a relatively new way of connecting leads from an integrated circuit package to a printed circuit board, allowing a higher pin count and function density than other connection methods and giving the lowest signal delay. These features make it an important component of modern high performance systems, but the density of leads makes manufacturing and process control very difficult.
  • ISBN13 9780070366084
  • Publish Date 31 January 1995
  • Publish Status Out of Print
  • Out of Print 21 February 2008
  • Publish Country US
  • Publisher McGraw-Hill Education - Europe
  • Imprint McGraw-Hill Professional
  • Format Hardcover
  • Pages 635
  • Language English