Second-Level Microelectronics Packaging

by Rao Tummala, Eugene J Rymaszewski, and Alan G Klopfenstein

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  • ISBN10 0412154714
  • ISBN13 9780412154713
  • Publish Date 1 March 1998
  • Publish Status Out of Print
  • Out of Print 24 May 2021
  • Imprint International Thomson Publishing Services
  • Format Hardcover
  • Pages 267
  • Language English