ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Volume 1: Thermal Management

by ASME

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Book cover for ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems Volume 1: Thermal Management

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Print proceedings of the ASME 2015 13th International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2015): Volume 1: Thermal Management.

Printed collection on 89 full-length, peer-reviewed technical papers. Topics include:
  • Thermal Management
  • ISBN13 9780791856888
  • Publish Date 30 July 2015
  • Publish Status Active
  • Publish Country US
  • Imprint American Society of Mechanical Engineers,U.S.
  • Format Paperback
  • Pages 784
  • Language English