High-Performance Embedded Computing: Architectures, Applications, and Methodologies

by Wayne Wolf

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Book cover for High-Performance Embedded Computing

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Over the past several years, embedded systems have emerged as an integral though unseen part of many consumer, industrial, and military devices. The explosive growth of these systems has resulted in embedded computing becoming an increasingly important discipline. The need for designers of high-performance, application-specific computing systems has never been greater, and many universities and colleges in the US and worldwide are now developing advanced courses to help prepare their students for careers in embedded computing. "High-Performance Embedded Computing: Architectures, Applications, and Methodologies" is the first book designed to address the needs of advanced students and industry professionals. Focusing on the unique complexities of embedded system design, the book provides a detailed look at advanced topics in the field, including multiprocessors, VLIW and superscalar architectures, and power consumption.Fundamental challenges in embedded computing are described, together with design methodologies and models of computation.
"HPEC" provides an in-depth and advanced treatment of all the components of embedded systems, with discussions of the current developments in the field and numerous examples of real-world applications. It covers advanced topics in embedded computing, including multiprocessors, VLIW and superscalar architectures, and power consumption. It provides in-depth coverage of networks, reconfigurable systems, hardware-software co-design, security, and program analysis. It includes examples of many real-world embedded computing applications (cell phones, printers, digital video) and architectures (the Freescale Starcore, TI OMAP multiprocessor, the TI C5000 and C6000 series, and others).
  • ISBN10 6611004106
  • ISBN13 9786611004101
  • Publish Date 1 January 2007 (first published 1 September 2006)
  • Publish Status Active
  • Out of Print 18 May 2011
  • Publish Country US
  • Imprint Elsevier Science & Technology
  • Format eBook
  • Pages 544
  • Language English