Microvias: For Low Cost, High Density Interconnects

by John Lau and Ricky Lee

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Book cover for Microvias: For Low Cost, High Density Interconnects

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A guide to microvias technology. It covers technology basics, design methods, heat concerns and developments, and surveys companies and products. Microvias products are essential to small mobile phones and other handheld electronic products, otherwise they would be twice their current size.
  • ISBN13 9780071363273
  • Publish Date 16 June 2001 (first published 26 April 2001)
  • Publish Status Out of Print
  • Out of Print 5 April 2008
  • Publish Country US
  • Publisher McGraw-Hill Education - Europe
  • Imprint McGraw-Hill Professional
  • Format Hardcover
  • Pages 450
  • Language English