Electronic Materials and Processes Handbook (Electronic Packaging and Interconnection Series (McGraw-Hill)

by Charles A Harper and Ronald M Sampson

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Book cover for Electronic Materials and Processes Handbook

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Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct today's cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design.
  • ISBN10 6610919186
  • ISBN13 9786610919185
  • Publish Date 1 January 2004 (first published 22 August 2003)
  • Publish Status Active
  • Out of Print 18 May 2011
  • Publish Country US
  • Imprint McGraw-Hill Companies
  • Format eBook
  • Language English