S.-W. Ricky Lee received his B.S., M.S. and Ph.D. degrees from National Taiwan University, VPI&SU and Purdue University, respectively. Currently Dr. Lee is Associate Professor of Mechanical Engineering at the Hong Kong University of Science & Technology (HKUST). He has contributed to numerous technical publications in various research areas and he is the co-author of two books on Chip Scale Packages and Microvias, respectively. Dr. Lee is very active in professional societies. He is a senior member of IEEE-CPMT, and a member of ASME and IMAPS. Also he is Chapter Chair of IEEE-CPMT Hong Kong Chapter. Dr. Lee's recent research activities are focused on flip chip technologies, wafer-level chip scale packaging, high density interconnects, and lead-free solders.
