The book provides a unique overview on laser techniques and applications for the purpose of improving adhesion by altering surface chemistry and topography/morphology of the substrate. It details laser surface modification techniques for a wide range of industrially relevant materials (plastics, metals, ceramics, composites) with the aim to improve and enhance their adhesion to other materials. The joining of different materials is of critical importance in the fabrication of many and varied products.


This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;

  • Various theories or mechanisms of adhesion
  • Surface (physical or chemical) characterization of materials as it pertains to adhesion
  • Surface cleaning as it pertains to adhesion
  • Ways to improve adhesion
  • Unraveling of interfacial interactions using an array of pertinent techniques
  • Characterization of interfaces / interphases
  • Polymer-polymer adhesion
  • Metal-polymer adhesion (metallized polymers)
  • Polymer adhesion to various substrates
  • Adhesion of thin films
  • Adhesion of underfills
  • Adhesion of molding compounds
  • Adhesion of different dielectric materials
  • Delamination and reliability issues in packaged devices
  • Interface mechanics and crack propagation
  • Adhesion measurement of thin films and coatings

The book provides a comprehensive and easily accessible reference source covering all important aspects of particle adhesion and removal. The core objective is to cover both fundamental and applied aspects of particle adhesion and removal with emphasis on recent developments.

Among the topics to be covered include:

1. Fundamentals of surface forces in particle adhesion and removal.
2. Mechanisms of particle adhesion and removal.
3. Experimental methods (e.g. AFM, SFA,SFM,IFM, etc.) to understand particle-particle and particle-substrate interactions.
4. Mechanics of adhesion of micro- and nanoscale particles.
5. Various factors affecting particle adhesion to a variety of substrates.
6. Surface modification techniques to modulate particle adhesion.
7. Various cleaning methods (both wet & dry) for particle removal.
8. Relevance of particle adhesion in a host of technologies ranging from simple to ultra-sophisticated.