This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
- ISBN13 9789811336263
- Publish Date 7 May 2019
- Publish Status Active
- Publish Country SG
- Imprint Springer Verlag, Singapore
- Edition 1st ed. 2019
- Format Hardcover
- Pages 287
- Language English